Nordson YESTECH

Corporate | Global Directory | Languages


FX-942 AOI System

The FX-942 dual sided automated optical inspection system offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

 

In-line Dual Sided Optical Inspection

  • Dual sided imaging with full travel imaging sensors
  • 1 vertical and 4 optional angle cameras per side
  • Up to 100 mm clearance
  • High speed inspection and transfer
  • High defect coverage / low false failure
  • Picture in Picture (P-in-P) feature
  • MES / Industry 4.0 compatible

 

Nordson YESTECH’s advanced multiple color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With dual sided top-down and bottom up viewing cameras, the FX-942 inspects solder joints and verifies correct part assembly in pre wave or post wave applications enabling users to improve quality and enhance yields.

The FX-942 is highly effective for selective solder, post wave and connector inspections. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

Related Solutions

Aerospace

The Nordson YESTECH line of AOI systems provide a variety of inspection solutions, ideally suited to meet the demands of the aerospace industry.

Automotive and Transportation
The Nordson YESTECH line of automated optical inspection systems provide a variety of inspection solutions, ideally suited to meet the demands of the automotive industry.

Medical
The Nordson YESTECH line of AOI systems provide a variety of inspection solutions, ideally suited to meet the unique demands of the medical devices industry.

PCB Assembly
Nordson YESTECH's full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the printed circuit board assembly market.

Semiconductor Packaging
Nordson YESTECH's full line of optical inspection systems offers cost-effective, integrated yield enhancement solutions for the advanced semiconductor packaging market.