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Nordson MARCH Wins 2015 New Product Introduction Award for its FlexVIA-Plus Plasma Treatment System

10 Mar 2015

System provides desmear and etchback plasma treatment of flexible electronic substrates with capacity of up to 30 panels per cycle

Jonathan Doan, Nordson MARCH, accepts award from Mike Buetow, editor Circuits Assembly

Jonathan Doan, Nordson MARCH, accepts award from Mike Buetow, editor Circuits Assembly

 
Concord, California, USA – 10 March 2015 -  Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, has won the 2015 New Product Introduction (NPI) Award in the General Cleaning category for its FlexVIA-Plus™ Plasma Treatment System. The system is designed for processing flexible PCBs in high-throughput flexible circuit board manufacturing operations. The Award was presented at IPC APEX 2015, held in San Diego, CA from February 24-26, 2015.

The FlexVIA-Plus is a fully self-contained system. Its economical gas consumption and small footprint maximize process capacity and minimize production floorspace for a low cost-of-ownership. The dual-rack chamber accommodates up to thirty, 20x24-inch panels in a single cycle, while versatile horizontal racks enable processing of various flexible PCB sizes and make loading easy. The high-performance desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials, and other resins while the descum capabilities effectively remove resist residue from inner layers and panels and residual solder mask bleed for better bonding and solderability.

“MARCH’s FlexVIA-Plus delivers patented plasma technologies that provide superior surface activation and etchback and desmear process uniformity on the flex material,” said Jonathan Doan, director of marketing, Nordson MARCH. “It builds on the 10-year success of the Nordson MARCH VIA™ line. We are honored to receive this award.”

The NPI award, sponsored by Circuits Assembly and Printed Circuit Design and Fab, part of UP Media Group, recognizes creativity and innovation, compatibility with existing technology, cost-effectiveness, expected reliability, flexibility, performance, and user-friendliness.

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