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Nordson MARCH’s Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

21 Sep 2016

Isolates plasma on the wafer, not the area around or below it

Plasma Confinement Ring

Concord, California, USA - 21 September 2016 - Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma cleaning technology, introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.

Using the confinement ring, there is a free conduction path between the upper and lower electrodes in the wafer region, but no conduction path in the adhesive tape and wafer frame area. The ring is made with an insulated, non-conductive material, while the aluminum-to-aluminum plasma conduction path is confined to the wafer area. There is a 2mm gap between the ring and the adhesive tape and wafer frame. Because there is no plasma generation or plasma to the bottom of the wafer and adhesive tape, undercutting and delaminating are minimized and there is no sputtering or adhesive tape deposition on the wafer surface.

"The big difference between our concept and most front-end systems is the spacing and confinement method," explained Jonathan Doan, director of marketing, Nordson MARCH. "In our method, we minimize the gap between the ring edge and lower electrode, resulting in a smaller spread area. This gap is roughly 2mm or less, so you only get secondary plasma, rather than primary plasma as you do on other systems. The overall chamber volume is reduced to just the area above the wafer."

The Plasma Confinement Ring is available with Nordson MARCH's SPHERE Series of plasma systems. Plasma applications include descum, ashing/photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

For more information contact Nordson MARCH at info@nordsonmarch.com or call +1.925.827.1240.

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