Nordson MARCH Offers Free Technical Consulting Services on Plasma Treatment at SMT Hybrid Packaging, Nuremberg, DAGE Deutschland Stand 6-314
28 Apr 2015
Plasma cleaning prior to wire bonding delivers a cleaner bonding surface, reducing device failures
Concord, California, USA – 28 April 2015 - Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma processing technology, is offering free technical consulting on how plasma treatment systems reduce premature device failures in the field and details ways your company can improve its manufacturing process through plasma cleaning. Nordson MARCH experts will be at the DAGE Deutschland stand #6-314 at SMT Hybrid Packaging 2015, being held in Nuremberg, Germany from May 5-7, 2015.
Plasma treatment has long been recognized as a valuable process in the microelectronics and semiconductor packaging industries. The introduction of an appropriate plasma process prior to wire bonding will always deliver a cleaner surface to bond to. Potential benefits are improved wire bond statistics, improved device reliability, and the elimination of excursions caused by non-systemic influences such as random pollution of the surfaces to be bonded by uncontrolled factors.
“Plasma has something of the aura of ‘alchemy’ or a ‘black box’,” explained John Maguire, business manager Europe, Nordson MARCH. “There are, nonetheless, realistic expectations about what plasma can contribute both to the performance of a wire bonding process and to the long-term reliability of the packaged device. The benefits of plasma are two-fold: improving the wire bonding process itself and ensuring the long-term reliability of the device. SMT Nuremberg attendees are invited to meet with me at the DAGE Deutschland stand #6-314 for a free consultation on how the quality and success of their manufacturing process and products can be enhanced greatly by plasma cleaning prior to wire bonding. Please contact me at email@example.com to set up an appointment or stop by the stand.”
You can access Nordson MARCH’s white paper Types and Causes of Wire Bond Failures and the Simple Solution – Plasma Clean Your Bond Pad in English and German by filling out the white paper form on this page.
For more information, contact Nordson MARCH in Europe at +31 433524466, in the US at +1.925.827.1240, email firstname.lastname@example.org.
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Press Release - German