Nordson MARCH Demonstrates FlexTRAK-CD Plasma System for Lead Frame and Strip-type Electronic Components at NEPCON Japan
12 Jan 2015
Nordson MARCH will be in East Hall 2, Booths 12-20
Concord, California, USA – 12 January 2015 - Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma processing technology, announces that it will be demonstrating its FlexTRAK™-CD Plasma System for high throughput processing of lead frame strips and other strip-type electronic components, up to 5 strips per plasma cycle, at NEPCON Japan, January 14-16, 2015 at Tokyo Big Sight, in East Hall 2, Booths 12-20. This compact machine provides high uniformity and tight control over process parameters for highly repeatable results. The system accommodates a wide range of strip sizes. Applications include plasma treatment for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill.
The FlexTRAK-CD system accommodates a wide range of strip sizes, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy. It removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing.
Nordson MARCH application experts will be at the booth to discuss how plasma treatment can help you reduce failures in the field and improve your manufacturing process.
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