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Nordson MARCH Introduces New FlexVIA-Plus™ Plasma Treatment System to Process Flexible Electronic Substrates

28 May 2014

Adds desmear and etchback capabilities plus increased capacity of up to 30 panels per cycle

FlexVIA-Plus™ Plasma Treatment System Concord, California, USA – 28 May 2014 -- Nordson MARCH, a Nordson company (NASDAQ:NDSN) and global leader in plasma processing technology, introduces its new FlexVIA-Plus™ Plasma Treatment System that delivers single-stage plasma processing – including etchback and desmear -- of up to 30 panels (panel size 500x813mm / 20x32 inch) per cycle, enabling a rate of as much as 200 units per hour (UPH) during the manufacture of flexible electronic PCBs and substrates.

The FlexVIA-Plus System’s advanced horizontal electrode design, with integrated rack, provides optimum material alignment for industry-leading plasma treatment uniformity. Versatile horizontal racks allow for processing of various flexible PCB sizes and make loading easy. The efficient design with its economical gas consumption and small footprint contributes to a low cost of ownership.

Specifically designed for the processing of flexible PCBs, the new FlexVIA-Plus Plasma System delivers patented, industry-proven plasma technologies that provide superior surface activation, etchback and desmear process uniformity on both sides of the flex material. The desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing. The descum capabilities effectively remove resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability. Temperature-controlled electrodes ensure consistent process repeatability.

“The new FlexVIA-Plus™ Plasma System performs similarly to our ProVIA™ system, but in a horizontal form-factor, which is ideal for processing flexible PCBs,” said Jonathan Doan, director of marketing, Nordson MARCH. “This system meets the demands of today’s high-throughput flexible circuit board manufacturing operations.”

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