With precise deposit control, Nordson EFD’s solutions improve yields and reduce costs in electronics and electro-mechanical manufacturing.
We help electronics manufacturers increase profitability with fluid dispensing solutions engineered for the most demanding production environments.
In benchtop assembly processes, our dispensers improve productivity by placing fluid more accurately and consistently. Our valve systems increase yields, while reducing material waste in automated and semi-automated operations used in electronics manufacturing, including mobile devices and wearables.
Nordson EFD's innovative line of automated dispensing systems includes industry-leading robots that increase output speed and batch quality, while offering incredibly simple and intuitive programming and operation.
In addition, our complete line of solder pastes improves quality and consistency. Meeting the most stringent standards in a variety of manufacturing applications for reliable process control, they increase throughput and first-pass yields.
Nordson EFD’s PICO Pµlse exchangeable, modular jet valve technology dispenses with industry-leading accuracy and speed to apply very precise, repeatable micro-deposits at 1000Hz…
The vision-guided PRO Series is Nordson EFD's most advanced automated dispensing system, designed and configured for precision and simplified usability.
The xQR41 Series MicroDot needle valve features QR (Quick Release) technology, a 60% smaller form factor, and modular design for new levels of customization in precision fluid dispensing.
Experience a new level of accuracy, consistency, and process control when dispensing fluids that change viscosity with Nordson EFD’s Ultimus V High Precision Dispenser.
Recommended for use in the manufacturing of electronics, SMT production, disk drives, and optical disks.
Nordson EFD’s comprehensive line of ISO 9001-certified solder paste solutions include high- quality printing and dispensing soldering pastes that meet the most stringent application…
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials.