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Hot Bar Reflow Soldering Systems

Flex carriers and foil connectors

Hot Bar Reflow Soldering ApplicationMobile electronics such as telecommunications equipment, as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers. The connection of the layers are favorably produced with flexible circuit carriers and / or foil connectors.These connections are prepared, mostly by Hot Bar Reflow Soldering. For equipping electronic devices with digital displays, display drivers on flexible carriers can be used. The connection to the rigid circuit board can be produced by using thermode soldering too. Furthermore the method can be used to join flat cable and foil cable with rigid components like plug connectors and PCBs.

Process

For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. Because pressure is applied during the complete cycle, the process is very suitable for parts that could disconnect during cooling down. By using Hot Bar Reflow Soldering process multiple connections (up to > 100mm length) can be made simultaneously in a single process cycle. Making these connections simultaneously also prevents wires disconnecting while soldering the neighboring one.

Hot Bar Reflow Soldering Benefits
  • Fast temperature ramp-up and cool-down
  • Closed loop temperature control
  • Accurate positioning of the parts
  • Multiple connections can be made simultaneously
  • Cost effective due to elimination of third component such as connector

Applications Hot bar Reflow Soldering
  • Connecting flex-foils to Printed Circuit boards
  • Small wires
  • Small coax cables
  • Very light or small components.

 

Soldering applications:

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Automated in-line solutions

Automated in-line solutions Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-TurnFlux

C-TurnFlux The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality…


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