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Heat Staking Systems

Heat Staking process

Heat Staking applicationDe-forming the plastic is achieved by heating it to a temperature above the glass transition temperature via the use of super-heated air or a thermode and then applying pressure in order to create the stake. After the stake has been formed the plastic should be cooled down again below the glass transition temperature. This cooling is done under constant pressure to ensure good fixation of the parts. Cooling can be done with the use of compressed air when using a thermode.

Heat is used to make it easier to create the stake. Heat control is critical, especially for glass filled plastics which often have a process window smaller than 10 degrees Celsius. When temperatures are too high the glass fibers come out of the plastic leading to a rough surface and sticking to the thermode. If the temperature is too low the plastic will crack due to cold deformation.

Heat Staking Benefits
  • Similar and dissimilar materials may be joined: metal to metal, plastic to plastic, metal to plastic
  • Accurate control operating within a small process window
  • Local heating resulting in no damage to surrounding materials
  • Processing of glass-filled materials
  • No mechanical vibration
  • Many heat stake shapes possible through custom designed tools
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Automated in-line solutions

Automated in-line solutions Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…


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