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Heat Seal Bonding Systems

Heat Seal Bonding / ACF Final Bonding

Heat Seal bonding applicationOnce the ACF Laminating process (or pre-tacking process) is completed the two parts to be joined are brought together in a fixture. This fixture (or jig) makes sure that the bonding parts fit perfectly together and ensured the repeatability of the process. Flex or other parts can be aligned with great accuracy to match the traces on the substrate or other parts that need bonding. More temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis. Subsequent cooling and full curing of the adhesive while still in the compressed condition stabilize the joint.

Benefits Heat Seal Bonding (also called: Hot Bar Bonding, Pulsed Heat Bonding)
  • Lead-free process
  • Smallest pitch >30 micron possible
  • Flux free process
  • Electrical connections to glass substrates
  • No cleaning required after process
  • Low process temperatures

 Step before Heat Seal Bonding: ACF Laminating

 

Bonding applications:

Heat Seal bonding application   Heat Seal bonding application

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Automated in-line solutions

Automated in-line solutions Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…


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