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ACF Laminating Systems

Anisotropic Conductive Film

ACF Laminating applicationAnisotropic Conductive Film (ACF), is a lead-free and environmentally-friendly interconnect system to make electrical and mechanical connections between two components. ACFs are widely used to perform flex-to-board or flex-to-flex connections used in LCDs, handheld electronic devices such as mobile phones, MP3 players, or in the assembly of CMOS camera modules.

ACF Laminating / Pre-Tacking

The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material, the material is transferred to the substrate.

Benefits ACF Bonding
  • Lead-free process
  • Smallest pitch >30 micron possible
  • Flux free process
  • Electrical connections to glass substrates
  • No cleaning required after process
  • Low process temperatures

 

Next step: Heat Seal Bonding

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Automated in-line solutions

Automated in-line solutions Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-Tack with touchscreen

C-Tack with touchscreen C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding. 


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