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Processes

Hot Bar Reflow Soldering Systems

Hot Bar Reflow Soldering Application Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode or a hot bar) to a sufficient temperature to…

Heat Seal Bonding Systems

Heat Seal bonding application Electrical conductive adhesive bonds can be made between flexible and rigid circuit boards, glass panel displays and flex foils. In the process the adhesive will be heated and cooled under pressure…

ACF Laminating Systems

ACF Tape on PCB b Electrical conductive adhesive bonds can be made between flexible and rigid circuit boards, glass panel displays and flex foils. In the process the adhesive will be heated and cooled under pressure…


Heat Staking Systems

Heat Staking application Heat Staking is a pulsed heat process to join two or more parts, of which one is at least made out of plastic. The process is to deform the plastic material using heat and force at a set process…


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