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Aerospace

Aerospace IndustryThe Aerospace and Defense Industries both require cutting edge technology, requiring components and products that can survive extreme stresses.Because of the high speeds that most aerospace products move at, they must be strong, but since they also must defy gravity, they also need to be light. To accomplish this, these industries use many specialized materials and processes. Parts must be designed and manufactured to precise specifications. Nordson DIMA product offerings are designed to deliver fast, precise, and quality results, for each and every component.

Typical Aerospace applications

  • Sensitive Electronics
  • Flexible circuits
  • Communication devices
  • Avionics displays
  • Space components  
  • Sensors

 
Processes

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Automated in-line solutions

Automated in-line solutions Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-TurnFlux

C-TurnFlux The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality…

C-Tack with touchscreen

C-Tack with touchscreen C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding. 


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