Nordson DIMA

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IPC APEX Expo 2018

San Diego Convention Center, 111 W Harbor Dr, San Diego, CA 92101

27 Feb 2018 - 01 Mar 2018

IPC APEX EXPO 2018 is a five-day event like no other in the printed circuit board and electronics manufacturing industry. Professionals from around the world come together to participate in the Technical Conference, Exhibition, and Professional Development, Standards Development and Certification programs.

 IPC APEX Expo 2018

 Nordson DIMA will be presenting two Hot Bar Systems on the Nordson ASYMTEK booth: 2114. 

The first is the C-Base Bonding/Soldering system, a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control, all packaged into an easy to use, multi-language, touch screen interface.

The second is the C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking. The C-Slide desktop system handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. All kind LCD, Flex foil and PCB connections can be made using these systems.

For more information about the show, visit the IPC APEX EXPO website.

We hope to see you in San Diego!

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