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Stud Pull

The stud pull test methodology involves the bonding of a back plate to the device which acts as a mechanical stop when applying the load which is applied using a disposable stud which has been glued to the die using a cynoacrelate.

The sample is then placed into a fixture (if testing horizontally) and the load is applied using a shear cartridge.  When testing in Z a stud is simply glued to the die and the load is applied by a pull cartridge.

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

Nordson DAGE

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

Nordson DAGE

4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

Nordson DAGE

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

Nordson DAGE

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