Nordson DAGE

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Cold Bump Pull

Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws. Tests are performed in accordance with:

  • JEDEC JESD22-B115
  • JEITA EIAJ ET-7407
  • IPC-9708

Cold Bump Pull 

The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested.  The jaws grip the solder ball without damaging the bonding area and applies a load that is virtually symmetrical to the area of attach, therefore applies a more uniform stress field to the ball.

The cold bump pull test method is required as traditional shear testing tends to deform the solder ball during the test such that the area of attach can become damaged during the process. Also border line failures can under some circumstances gain support from the side wall of a cavity and traditional shear testing may miss this.

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

Nordson DAGE

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

Nordson DAGE

4000HS High Speed Bondtester

4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…

Nordson DAGE


4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

Nordson DAGE

4000W Wafer Handling System

4000W Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system.  This wafer handling system provides automatic…

Nordson DAGE

4300FP - Semi-Automatic Wafer Bump Testing

4300FP - Semi-Automatic Wafer Bump Testing The Nordson DAGE 4300FP eliminates manual handling of expensive wafers.  It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic…

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4800 Bondtester

4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Whilst heralding progression in bond testing technology it’s heritage…

Nordson DAGE

Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

Nordson DAGE

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

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Unique Multi-Function Cartridges

Unique Multi-Function Cartridges Switch Applications in Just Seconds! Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…

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Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.

Nordson DAGE


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