Nordson DAGE

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Bump Shear

Nordson DAGE Bondtesters provide bump shear testing (up to 5kg) for use in the production test environment to remove the solder ball from a device or substrate.

Ball Shear

This methodology is well suited to test small geometry components with 0.25 micron shear height, with step back accuracy, on a S25 gram cartridge.

Using a stable dual arm microscope for high power optics and a precision XY stage with micron nudge buttons in X, Y and Vector the bump shear test also utilises a selection of camera systems for load tool to bond alignment, post-test inspection, failure analysis and video capture. There is also a precision camera to assist alignment.

Step back is defined as the distance between the tip of the load tool and the surface adjacent to the bond.

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

4000HS High Speed Bondtester

4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…


4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

4000W Wafer Handling System

4000W Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system.  This wafer handling system provides automatic…

4800 Bondtester

4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Whilst heralding progression in bond testing technology it’s heritage…


Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

Unique Multi-Function Cartridges

Unique Multi-Function Cartridges Switch Applications in Just Seconds! Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…


Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.


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