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Ball Shear/Solder Ball Shear

The solder ball shear test is one of the most common tests undertaken on a bondtester. Solder balls are sheared individually with a tool aligned at an accurate position above the device’s surface and the force measured throughout the test. Shear testing is in accordance with:

  • JEDEC JESD22-B116 - Au Ball Shear
  • JEDEC JESD22-B117 – Solder Ball Shear
  • ASTM F1269 - Ball Bond Shear

Ball Shear

The position of shear tool during testing is critical for accurate and repeatable test results. Nordson DAGE shear tools identify the device surface using an automatic touchdown feature and high precision positioning provides shear height accuracies of +/- 0.25 microns. Touchdown is achieved using a patented load cartridge clamping system and the exceptional position accuracy ensures that every ball bond is sheared at the same height relative to the surface that it is bonded on.

The shear tool is typically a flat, chisel shape but as an alternative, the cavity shear tool can be used. The cavity distributes the load over a larger area and reduces ball deformation. 

The precision alignment of the shear tool to the bond is achieved using optics and joystick control of an XY stage. For smaller samples it is possible to add an optional borescope imaging system (similar to an endoscope) and the sample being tested can be displayed on an LCD monitor enabling the operator to easily align the shear tool to the ball bond and more accurately assign a failure mode grade.

Nordson DAGE bondtesters provide:

  • System accuracy up to +/- 0.1% of selected load range
  • Shear height accuracy up to +/- 0.25µm
  • A range of optical systems for alignment, failure mode analysis and live recording.

4000 Multipurpose Bondtester

4000 Multipurpose Bondtester The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple wire pull tester and upgraded to provide ball shear, die…

4000 Optima Bondtester

4000 Optima Bondtester The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.  The combination of patented…

4000HS High Speed Bondtester

4000HS High Speed Bondtester The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both…


4000Plus Bondtester

4000Plus Bondtester The second generation Nordson DAGE 4000Plus is the most advanced bondtester on the market.  Representing the best-in-class, the 4000Plus bondtester sets the industry standard in bond testing offering…

4000W Wafer Handling System

4000W Wafer Handling System The Nordson DAGE 4000W system enables the industry standard 4000 multipurpose bondtester to interface with an industry standard wafer handler system.  This wafer handling system provides automatic…

4800 Bondtester

4800 Bondtester The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm. Whilst heralding progression in bond testing technology it’s heritage…


Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

Unique Multi-Function Cartridges

Unique Multi-Function Cartridges Switch Applications in Just Seconds! Nordson DAGE’s thorough understanding of bond testing in the volume manufacturing environment underpins the no-compromise development of industry-unique…


Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.


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