Nordson DAGE

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Industrial & Machinery

Nordson DAGE Bondtester and X-ray systems are widely used for precision destructive and non-destructive testing and inspection where electronics and mechanical components are involved. 
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Computerized Tomography (CT) Option

Computerized Tomography (CT) Option The Nordson DAGE µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems

Heated Stage X-ray Option

Heated Stage X-ray Option The Heated Stage is specifically designed to observe solder paste flow in real time. The ability to simulate the temperature environment of a thermal oven or that of an external environment makes…

X-Plane System Option

X-Plane System Option Watch the video to find out more about X-Plane System option. 


Micro Materials Testing

Micro Materials Testing With 30 years' experience in small geometry testing, Nordson DAGE pioneers mirco materials testing, offering unrivalled expertise and capability across a range of materials and applications.

Paragon™ Software

Paragon™ Software Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced…

Vision Systems

Vision Systems Nordson DAGE offers a range of powerful optical solutions for bondtesting and micro materials testing, featuring imaging systems for failure mode analysis, alignment and live recording of tests.


XD7500VR Jade FP

XD7500VR Jade FP High quality, real time imaging for production tasks, Jade FP is the cost effective choice for electronics inspection.

XD7800NT Ruby XL

XD7800NT Ruby XL The Solution for Large Board Applications


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