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Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at SMT

09 May 2017

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

 

Nordson DAGE will demonstrate their flagship system – the new Quadra™ 7 with 0.1μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP™ detector.

The Quadra™ 5, with industry-leading core technology will also be showcased.  This system

offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10 W of power, makes the Quadra™ 5 the leading choice for printed circuit board and semiconductor package inspection.

 

Nordson MATRIX - the market leader for automated inline X-ray inspection and pioneer for innovative inspection technologies – complements its existing application spectrum of SMT and PTH solder joint inspection with power hybrid applications (e.g. IGBT), battery inspection and wire bond testing. By focusing on these applications Matrix answers the increased demand for more safety and quality inspection of consumer products like smartphones or earphones. The flexible configuration of its inline systems offers maximum possibilities to adapt to customer specific needs as one can choose between different inspection technologies (2D Transmission, SFTTM, 2.5D Off-Axis, 3D SART) depending on the actual inspection demand. Visit us and find out more about our unique X-ray inspection system portfolio.

The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.  With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 m2.