Nordson DAGE's Peter Koch to discuss failure analysis with X-ray at EPP's Innovations Forum
03 Mar 2015
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany.
Mr. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane™ (Tomosynthesis) and CT. Additionally, Mr. Koch will discuss how the shape of the BGA balls or voiding can give a good indication of the failure.
The presentation will analyze failures on different components such as resistors, capacitors and wire bonds. Nordson DAGE X-Plane® and CT-images will be shown. Mr. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.
Peter Koch studied the Science of Materials at the Technical University in Erlangen-Nürnberg, Germany. He is Nordson DAGE’s European X-Ray Application Engineer and has worked for the company for the last ten years.