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Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

18 May 2015

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco.  Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.

The Nordson DAGE 4800 Bondtester is at the forefront of wafer testing technology, developed for testing wafers from 200mm up to 450mm. Intuitive and intelligent Nordson DAGE Paragon™ software provides the ultimate flexibility for the creation and mapping of wafers, enabling quick and precise setup of test patterns. The virtual images for each test pattern enable easy editing. 
 
Nordson DAGE also will highlight its award-winning 4000Plus Bondtester Camera Assist Automation System, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.  Additionally, Nordson DAGE’s X-Plane™ and CT options will be demonstrated at the show.  X-Plane™ uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly (PCBA) without the need to cut or destroy the board.

Nordson DAGE’s XM8000 Wafer Metrology Platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. It provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay and critical dimensions. More information about this system can be found in Booth # 1413.

For more information about Nordson DAGE, meet with their Test and Inspection experts at SEMICON West or visit www.nordsondage.com.