Nordson DAGE Announces Further Orders for its Unique Patented Hot Pin Pull Test Method
17 Nov 2014
The only system that fully complies with IPC-9708 test standards
Nordson DAGE a division of Nordson Corporation (NASDAQ: NDSN) reports that several leading manufacturers of complex multi-layer printed circuit boards have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and printed circuit boards in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Pad cratering can be caused by lead free solders that transmit larger strains to the bond pad which inturn produce cracks in the laminate and these cracks can extend if the board is subject to high strain rates, shock or thermal cycling which will result in the eventual failure of the interconnect.
Nordson DAGE use a special technique called “Hot Pin Pull” testing which involves attaching a test probe to an individual solder ball with a controlled temperate / time profile. Once cooled the probe is subjected to a pull test which applies a test load that is symmetrical to the solder ball attach to the bonding pad. The entire process is localised to the solder ball/pad that is being tested.
Variable angled work holders (typically 30 degrees) are available as an option which maximise the tensile stress for those most highly strained bonds at the edge of the die.
The second generation Nordson DAGE 4000Plus
is the most advanced bondtester on the market. Representing the best-in-class, the 4000Plus sets the industry standard in bond testing offering unsurpassed accuracy and repeatability of data, providing complete confidence in results.