Nordson DAGE

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NEPCON South China 2017

18 Aug 2017

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.

The Nordson DAGE Quadra™ 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10 W of power, makes the Quadra™ 5 the leading choice for printed circuit board and semiconductor package inspection.

Nordson DAGE also will highlight its award-winning 4000Plus Bondtester with Camera Assist Automation, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. 

The Nordson MatriX X2.5# is an automated X-ray inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray technology with patented Slice-Filter-Technique (SFT) and Off-Axis technology present a reliable solution for the inline inspection of double-sided PCB assemblies. The X2.5# movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
 
Nordson YESTECH’s FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process. The system inspects for quality and consistency of coating coverage under proprietary ultra violet lighting with the use of proprietary inspection algorithms. An optional coating thickness measurement package also is available.