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Latest news from Nordson DAGE


Nordson DAGE Announces AB Electronic Devices as European Distributor of the Year 2015 for X-ray Systems

07 Jan 2016 - Nordson DAGE

Nordson DAGE Receives a Prestigious Global Technology Award for the 4800 Wafer Level Bondtester

19 Nov 2015 - Nordson DAGE

Advanced automated wafer testing from the market leader in bondtesting

Discover Leading Test and Inspection Platforms from Nordson at SMTAI

24 Sep 2015 - Nordson DAGE

Aylesbury, Buckinghamshire, UK — September 2015 — Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #606 at SMTA International, scheduled to…

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

18 May 2015 - Nordson DAGE

China Vision Awards

01 May 2015 - Nordson DAGE


Dual Win for Nordson DAGE Camera Assist Automatic Bondtesting at Nepcon China 2015

21 Apr 2015 - Nordson DAGE

Fourth Award for this application

Nordson DAGE's Peter Koch to discuss failure analysis with X-ray at EPP's Innovations Forum

03 Mar 2015 - Nordson DAGE

Nordson’s Hal Hendrickson Appointed to the IPC APEX Exhibitor Committee

12 Feb 2015 - Nordson DAGE

Nordson YESTECH, a division of Nordson Corporation (NASDAQ: NDSN), announces that Hal Hendrickson, Sales Director – Inspection Products for the Company’s Global Accounts, has been appointed to the…

Nordsons Hal Hendrickson Appointed to the IPC APEX Exhibitor Committee

12 Feb 2015 - Nordson DAGE

Nordson DAGE Announces the Introduction of a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014

10 Dec 2014 - Nordson DAGE

Nordson DAGE X-ray Systems Announces European Distributor of the Year 2014

28 Nov 2014 - Nordson DAGE

Nordson Advanced Technology KK Japan Moves to Larger Customer Focused Facility

26 Nov 2014 - Nordson DAGE

Supports Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson YESTECH for applications in semiconductor packaging and electronics assembly

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