Nordson DAGE

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News

15 Mar 2018

Maintenance Free X-ray Inspection now available for PCBA production applications

A new edition to the Nordson DAGE Quadra™ Series family

27 Nov 2017

Inspection Leader Nordson DAGE Earns Its 20th Award at productronica

XM8000 Wafer X-ray Metrology system wins a Global Technology Award

24 Oct 2017

Nordson DAGE Announce 2017 European X-ray Distributor Award Winners

Nordson DAGE has a strong portfolio of award winning products for destructive and non-destructive mechanical testing and inspection of electronic components. It has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the USA, and maintains representative offices in other territories.

With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as BGA, Chip Scale Packages (CSP) and other electronic components. More recently Nordson DAGE has been heavily involved in the testing of the newest technology 300 mm wafer bump shear.

Nordson DAGE has developed an excellent suite of award-winning X-ray inspection equipment targeted at both the Semiconductor and PCBA markets.

Control of the patented core technology of X-ray tube manufacture ensures that the high-resolution X-ray will detect, identify and measure even the smallest of features. Nordson DAGE's high precision, state-of-the-art inspection equipment when joined with their sophisticated software offerings, ensure that the equipment is simple to use.

Click here to read about our core strategy.

 

 

Featured Product 

Featured Product 

Featured Product

 

 Quadra™ 7 X-ray System

 4000Plus Bondtester  XM8000 Wafer Metrology Platform
   Quadra 7 4000Plus Bondtester   XM8000 Wafer