Nordson DAGE

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Market leading, award
winning bond testing equipment at the cutting
edge of bond tester
Micro Materials Testing
Unrivalled expertise and capability in small geometry testing across a range of materials and applications.
Wafer X-ray Metrology
XM8000 offers fast automatic X-ray measurement of TSVs, 3D packages, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions.
X-ray Systems
Award winning X-ray inspection systems specifically designed for the PCB and semiconductor industries offering high resolution nano-focus X-ray systems.
Service and Support
Get the most out of your test and inspection equipment throughout its entire lifecycle.
Our services have been designed to suit you whether your Nordson DAGE equipment is brand new or has been in service for a number of years.


19 Nov 2015

Nordson DAGE Receives a Prestigious Global Technology Award for the 4800 Wafer Level Bondtester

Advanced automated wafer testing from the market leader in bondtesting

24 Sep 2015

Discover Leading Test and Inspection Platforms from Nordson at SMTAI

Aylesbury, Buckinghamshire, UK — September 2015 — Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #606 at SMTA International, scheduled to…

11 Jun 2015

Nordson DAGE Xi3400 Automated X-ray Inspection System to Make European Debut at SMT 2015


16-18 Dec 2015

Semicon Japan 2015

Tokyo Big Sight, Tokyo, Japan

Hall 1 - Booth 1429

13-15 Jan 2016

Nepcon Japan 2016

Tokyo Big Sight, Tokyo, Japan

Hall 3 - Booth No. E13-20

15-17 Mar 2016

APEX 2016

Las Vegas Convention Center,  Nevada, USA

Visit Nordson Test and Inspection - Booth No. 1845