Thermal Interface Material (TIM)
Dispensing highly viscous and high-wear compounds is achieved with Nordson ASYMTEK dispensing systems
Electronic designs are being developed using thermal compounds to remove heat from high-power devices. Nordson ASYMTEK is able to dispense most of these highly loaded materials with high speed and accuracy that fits large-scale production in semiconductor packaging, PCBA, case and product assembly, and other precision assembly operations.
Flexibility in the software of our systems allows almost unlimited program patterns to be dispensed to meet your application.
Thermally conductive materials are required to conduct heat away from the die. These fluids tend to have a short pot life and may be temperature sensitive. Fillers in these fluids can easily clog typical valves.
To meet customer demand for faster speeds and greater precision when dispensing Thermal Interface Material (TIM), Nordson ASYMTEK has developed new components for its valves.