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Improve UPH and Quality with Automatic Dual-Simultaneous Dispensing

Automatically accommodate component height variations and skew

UPH Improvements 

Smartphones have remained in high demand since their commercial introduction throughout the early 2000s. Over the years, manufacturers have continued to introduce thinner, faster, and more powerful phones with a variety of new capabilities. This ongoing innovation continues to drive consumer demand which in turn requires smartphone manufacturers to continually focus on UPH, quality, and dense component assembly improvement opportunities.


For example, thermal interface material (TIM) applications are commonly used in smartphone manufacturing to protect end users from heat that is generated when the phone is in use.  With TIM applications, manufacturers can dispense to large volumes of multi-up, panelized, and patterned smartphone motherboards that are consistently spaced which improves UPH. This advantageous approach can be further optimized by employing two jets, pumps, or valves instead of one resulting in additional UPH gains. However, there are inherent challenges when dispensing with two jets, pumps, or valves.

To ensure that heat is sufficiently dissipated when a smartphone is in operation, it is critical to control the dispense height to preserve the thermal conductivity between the internal electronic components and the sealed smartphone case. In addition, each motherboard features components that vary in height, and inconsistent placement of components during the pick-and-place and reflow process results in positional skew in relation to neighboring components and component height variance from motherboard to motherboard. Automatic Dual-Simultaneous Dispensing with instant x and y pitch and Z-height adjustments can accommodate these off-grid placements and further boost UPH and quality outcomes.


How it Works

Use Automatic Dual-Simultaneous Dispensing to:

  1. Reduce dispense time by half – mount two jets, pumps or valves (with the same fluid) on one Z-head to dispense repeated patterns with each valve simultaneously.

  2. Automate height sensing – for motherboards that have inconsistent surface heights or flatness, the ADS system can independently adjust the Z-height of each jet or valve (ADS+Z) to ensure consistent dispense gap and line quality.

  3. Automate skew adjustment – global fiducials are used to detect workpiece rotational skew and then automatically adjust the pitch between the two jets or valves to accommodate the skew.

  4. Automate translation adjustment – translation can also occur between two components as a result of the pick-and-place process. Local fiducials are used to detect and further adjust the x and y pitch as needed.

 Additional setup is required to use Automatic Dual-Simultaneous. It is available on the Spectrum™ II system.

Make the Most of UPH and Quality Improvement Opportunities

In the following smartphone TIM application example, Automatic Dual-Simultaneous Dispensing with Z-height adjustment (ADS+Z) delivers a UPH increase of 62.7% and a cycle time reduction of 38.5% when compared to single valve dispensing.


Cyce Time ADS+Z

For more information about the setup and use of Automatic Dual-Simultaneous Dispensing, please contact us at asktheexperts@nordsonasymtek.com

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