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Improve Productivity - Jet Underfill into Narrow Gaps Fast

Increase productivity in your underfill dispensing process

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The Adoption of Emerging Packaging Technologies

The Chip-on-Wafer (COW) process has enabled several emerging semiconductor packaging technologies including 3D packaging, Fan-out Wafer Level Packaging Package-on-Package (FOWLP PoP), and Chip-last FOWLP. High-volume manufacturers are adopting these advanced packaging technologies to realize increased productivity and cost reduction goals that are beyond the reach of the Chip-on-Chip (CoC) process. With the COW process, manufacturers can process multiple chips (or packaged components) and stack them vertically on a 300 mm wafer rather than stacking them individually as in the CoC process. As a result of this significant advancement, the adoption of the COW process continues to accelerate across a variety of new applications.

Jetting Underfill into Narrow Gaps


As the chip population on wafers increases, the gap between the chips becomes narrower – down to a few hundred microns.  At the same time, bump heights underneath the chips are reduced – down to tens of microns for small form factors. Large volumes of underfill must be cleanly delivered between the chips and then flow under each chip around the bumps. These narrow spaces and tight geometries require a new approach to the underfill dispensing process.

Understanding the Challenges:

  • When dispensing into narrow gaps, the total amount of underfill is typically distributed over multiple dispensing passes that deliver less fluid per pass, allowing time for the fluid to flow under the chip. However, to achieve the ultimate goal of increased wafers-per-hour, high volumes of underfill – in the form of small dots – must be dispensed quickly.

  • A second challenge is to prevent fluid contamination on top of the chip or other components, if the fluid stream is not narrow enough or cannot be precisely controlled.

  • To overcome this limitation, underfill must be jetted at a high frequency using a fine, narrow stream.

How Did We Solve the Challenge?

We designed a high-frequency, piezo-driven jet dispenser that is capable of jetting dots below 250 µm in width while maintaining dot volume – the IntelliJet® Jetting System which is offered on newer Nordson ASYMTEK platforms such as the Spectrum® II Premier. The IntelliJet is designed to meet the unique requirements of the COW process by delivering:

  • Smaller dot sizes and narrow jetted stream widths to accommodate narrow scribe-line and underfill requirements – Stream widths less than 250 µm in in-air width.

  • Higher jetting frequencies to enable large-volume dispensing and to compensate for small individual dot volumes – an average 600 Hz frequency with a 1000 Hz peak frequency.
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Increase productivity in your underfill dispensing process. Contact us to learn more about the IntelliJet Jetting System.

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