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DispenseJet DJ-2200 Spray Valve

Flux application using the DispenseJet® DJ-2200 spray valve delivers uniform, thin-layer dispensing of materials and superior edge definition for coating applications in flip chip and other semiconductor package

The DispenseJet DJ-2200 spray valve uses a patented high-precision mechanism to dispense fine layers of fluid directly from the nozzle onto the substrate. Layer thickness consistency is aided by a built-in heater that controls the fluid temperature and facilitates the dispensing process. The syringe/reservoir is completely sealed - providing full and constant pressure at all times. This allows high-speed, non-contact dispensing of low-viscosity materials such as rosin and no-clean fluxes with sharp, clean cut-off. Coupled with a recirculation reservoir, the DJ-2200 is also used for dispensing materials such as low viscosity silver epoxy for EMI shielding applications or silicone-phosphor for LED phosphor coating.

With the DJ-2200, the valve moves in an X, Y plane to dispense a variety of pre-programmed patterns that create a uniform film. The Z-axis is not required to move during or between dispense cycles. Time elapsed between cycles is minimized, and throughput and productivity are increased.

Spray coating with the DJ-2200 can also improve total cost of ownership. In spray flux applications, the DJ-2200 not only provides 100% coverage with a minimal amount of flux (typically 5 µm thin layers) but also produces less residue after reflow. Less residue results in better package reliability and higher yield. In EMI spray shielding applications, the DJ-2200 has been proven to reduce overspray and significantly reduce production costs by minimizing the waste of expensive coating fluids.

Features

  • Dispenses precise lines of fluid in thin layers for passive and active components
  • Changes in part layouts can be accommodated without downtime and tooling changes
  • Reduces fluid waste and improves material utilization with minimal maintenance
  • Separates dispensing and chip placement operations to achieve higher throughput
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