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IMAPS Device Packaging 2017

WekoPa Resort and Casino, Fountain Hills, Arizona USA

07 Mar 2017 - 09 Mar 2017

Please join Nordson ASYMTEK for the INTERACTIVE POSTER SESSION & HAPPY HOUR on Wednesday, March 8 and learn about EMI Shielding: Improving Sidewall Coverage with Tilt Spray Coating from Michael Szuch, Nordson Asymtek. Then come to the TECHNICAL SESSIONS on Thursday morning, March 9 to hear our Hanzhuang Liang present on Precise, High-throughput Underfill Dispense in Chip-on-Wafer Packaging.

March 7-9, 2017
WekoPa Resort and Casino
Fountain Hills, Arizona USA
IMAPS Device Packaging