for Electronics Manufacturing and related industries
Automated Optical PCB Inspection (AOI) Equipment 
Products and systems sold under the Nordson YESTECH brand use high resolution cameras to inspect printed circuit boards (PCB) for defects, enabling users to improve quality and increase throughput. Nordson YESTECH systems employ advanced Thin Camera™ technology, offering high-speed device inspection with exceptional defect coverage.
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High Speed Bondtesting Equipment
Products and systems sold under the Nordson DAGE brand provide electronic device manufacturers with the capability to simulate impact and high strain rate loads on solder ball connects. Nordson DAGE equipment is capable of performing a wide variety of testsm, including wire pull, solder bump pull, solder bump shear, wafer handling pull and shear, zone ball shear, die shear.
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X-Ray Inspection Equipment
Nordson offers a full range of X-ray inspection equipment for electronic device manufacturers and related applications.
High resolution - batch processing x-ray inspection systems: - Nordson DAGE x-ray inspection systems are among the highest resolution systems available in the world
In-line processing x-ray inspection systems: Nordson YESTECH x-ray inspection systems provide high speed inline processing.
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Other Nordson Test & Inspection Products
Verification for Hot Melt and Cold Adhesive Dispensing
Nordson adhesive verification systems provide on-line quality control for hot melt or cold adhesive as well as a diverse range of substrate properties and bar codes. The simplest systems can easily be programmed to detect presence and accuracy of bead placement. More sophisticated systems provide easy programming to simultaneously detect and verify numerous parameters, and can integrate with pattern control capability for even simpler set-up and operation.
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Test and Inspection for Coating Systems
Nordson offers several testing and inspection products associated with its powder coating and container coating product lines.