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Semiconductor Packaging

Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution X-ray inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the advanced semiconductor packaging market.

 

Small, high-density semiconductor integrated-chip (IC) packaging, such as ball-grid arrays (BGAs), has gained widespread developer acceptance because it enables increased device performance and printed circuit board (PCB) size reduction and introduces acceptance inspection complications. Because the ICs in these packages have hidden solder joints, automated optical inspection (AOI) alone is no longer sufficient to ensure solder integrity. Accordingly, manufacturers have incorporated X-ray inspection systems to check area-array and IC components.

By combining AOI and X-ray imaging technologies, chip manufacturers, system assemblers and developers can reap the benefits of both without sacrificing operational throughput or test time. The result is an integrated test system that cost-effectively inspects assembled PCBs.

Related Products

FX Series AOIFX Series AOI

The FX Series AOI offers high-speed PCB assemblies inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput.

M1 Series AOIM1 Series AOI

The M1 AOI offers high-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide.

M1m AOIM1m AOI

The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.

BX AOIBX AOI

The BX AOI offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

X3 3D X-RayX3 3D X-Ray

The X3 3D system permits users to discriminate between the top and bottom sides of boards. The X3 Automated X-Ray Inspection Systems (AXI) offer complete inspection of solder joints and other critical hidden features.

X2 2D X-RayX2 2D X-Ray

The versatile X2 2D Automated X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB’s and packaged semiconductors

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