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Microelectronics assembly from Nordson.


Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution X-ray inspection systems. The full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the microelectronics assembly market.

Increased demand for smaller electronics is driving the microelectronics packaging industry to develop smaller, more efficient component level packages. Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are developed for use in high-volume production.

Nordson YESTECH’s
M1m AOI has specific design enhancements to directly address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes.

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The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.

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