Precision, accuracy, and reliability are mandatory in the manufacture of medical device components. In recent years, yield improvement and rework systems have emerged as areas of significant interest to manufacturers of PCBs used in medical device assembly. This interest is largely motivated by the fact that an immense volume of process and test data is generated by a typical PCB manufacturer during test operations of these devices. The volume of data generated continues to grow as automated instrumentation continues to develop.
Rapid defect identification and analysis can be advantageous because it can reduce the response time, rework, and costs caused by defects in manufacturing of high reliability medical device components. As a result, manufacturing engineers and quality control personnel are constantly challenged by the need to rapidly collect and analyze any new data and use it to improve yield rates of medical device components.
Nordson YESTECH’s complete line of AOI and X-Ray inspection solutions are designed to meet these high-accuracy application demands in the medical device packaging field.