Automated In-line X-Ray Inspection System
Automated 2D & 3D inspection
Unsurpassed image quality
High defect detection
Low false calls
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Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
Programming is fast and intuitive. Nordson YESTECH’s state of the art,patented Digital Tomosynthesis Technology aquires multiple images in different slice heights in one inspection cycle.The images can discriminate between components on the top and bottom slices ofdouble sided boards for unimpeded automated inspection.
The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate.
When integrated with Nordson YESTECH AOI inspection, these systems can increase fault coverage to include nearly all process defects. Optional remote programming and SPC software can be utilized to provide a comprehensive yield enhancement solution.