X2 2D X-Ray

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Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB’s and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

Programming is fast and intuitive. Operators typically take less than 60 minutes to create a complete inspection program. Utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate.

The Nordson YESTECH X2 Automated X-Ray system is an effective inspection tool for ball grid array devices, computer components under shields and complex high density boards. When integrated with Nordson YESTECH AOI systems, the X2 can increase fault coverage to include nearly all process defects. Optional remote programming and SPC software can be utilized to provide a comprehensive yield enhancement solution.