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M1 Series AOI

M-size In-Line Automated Inspection

  • Quick Set-up
  • High Speed
  • High Defect Coverage
  • Low False Failure Rate
  • Smaller Footprint
  • Best Price Performance

  •  Download Specification Sheet 

    Nordson YESTECH's advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.

    Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.

    Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

    Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

    Related Solutions

    Aerospace
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the demands of the aerospace imdustry.

    Automotive
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the demands of the automotive imdustry.

    Medical
    The Nordson YESTECH line of AOI and X-Ray systems provide a variety of inspection solutions, ideally suited to meet the unique demands of the medical devices imdustry.

    PCB Assembly
    Nordson YESTECH's full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the printed circuit board assembly market.

    Semiconductor Packaging
    Nordson YESTECH's full line of inspection systems offers cost-effective, integrated yield enhancement solutions for the advanced semiconductor packaging market.

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    BX AOIBX AOI

    The BX AOI offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

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