The FX Series of AOI systems offers advanced 5 megapixel color image processing, exceptional defect detection and high-speed throughput. These features come together to create a quick, accurate, non-destructive inspection system for printed circuit boards (PCB) and other micro-electronic devices. This same exceptional technology is available in a tabletop model, the BX. For x-ray inspection, the X1 system offers high-resolution inspection capabilities for PCBs and components, including ball grid arrays (BGAs) and flip chip devices. And Nordson YESTECH’s new X3 3D automated x-ray inspection system sets the new industry standard for solder joint inspection with it’s patented Digital Tomosynthesis Technology.
In May 2007, YESTech Inc. was acquired by Nordson Corporation, joining Nordson’s Advanced Technology Systems segment. The addition of Nordson YESTECH's AOI and automated x-ray systems expanded Nordson’s product offerings and strengthened its presence as a premier test and measurement equipment provider.
Founded and managed by experienced industry experts with a history of success, Nordson YESTECH brings powerful and cost-effective inspection and yield enhancement solutions to the electronics market. The company currently has sales offices and customer support centers in America, Europe and Asia to support customers needs’ on a local basis.