Carlsbad, CA, USA –
Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) and a leading supplier of automated optical and x-ray inspection systems for the electronics industry, will showcase the newly upgraded YESPC software and feature their FX Series AOI and advanced technology 3-D X-Ray inspection solutions for populated printed circuit boards at this years’ APEX Printed Circuits Expo in Las Vegas, Nevada from April 6-8. Live demonstrations will be held in booth 1759 of their complete line of AOI and X-Ray systems, showcasing the powerful new features of the upgraded YESPC software.
Nordson YESTECH’s YESPC software is a web-based SPC (Statistical Process Control) tool that can be utilized for both real-time and historical charts and inspection reports. When utilized in real-time mode, YESPC enables engineers to focus on defect prevention by monitoring for unwanted trends in the manufacturing process. User selectable "chart windows" can be configured to show defect paretos, yield trends, machine utilization, as well as X-Y positional and Cp/Cpk data. The latest version of YESPC now includes enhanced functionality in pareto charts that allows the user to drill down to defect and false call images. The latest upgrade of YESPC software maximizes the capabilities of Nordson YESTECH’s line of inspection solutions.
The new FX series delivers the most complete inspection solution to date from Nordson YESTECH, providing advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 010005 components. Programming is fast and easy; operators typically take less than 30 minutes to create a complete inspection program, including solder inspection. The system utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Nordson YESTECH's Advanced Fusion Lighting™ and 5 megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate. And because the FX Series is configurable for all line positions, it is equally effective for paste, pre / post-reflow and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Nordson YESTECH’s advanced technology X3 Automated X-Ray Inspection System (AXI) provides electronics manufacturers 3D inspection capability for fast and complete inspection of double sided PCBs with BGAs and other critical solder joints. The X3's proprietary tomographic imaging technology rapidly gathers multiple oblique images to digitally construct three dimensional renderings that are used for unobstructed inspection of solder and component related defects on double sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. The X3 offers the advanced image resolution available today, which is critical for maximum defect detection.
"We are very pleased to be showcasing our new inspection solutions and upgraded YESPC software and at this years APEX show," said Don Miller, Nordson YESTECH President. "Our YESPC software truly maximizes the capabilities of our inspection solutions, offering customers a powerful and easy to use process control tool."
Editor's Note
High-resolution images of Nordson YESTECH’s product line are available by calling (949) 439-5351 or by visiting http://www.kreativesolution.com/NYT-APEX2010.htm For pricing and availability call Nordson YESTECH's USA HQ at: 760-918-8471 or visit the Nordson YESTECH website at http://www.nordsonyestech.com
About IPC Printed Circuits Expo, APEX 2010
The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC Printed Circuits Expo. APEX 2010 and to register, visit http://www.goipcshows.org
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical and high-resolution x-ray inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries. Founded in 2002 and acquired in 2007 as a subsidiary of Nordson Corporation (Nasdaq:NDSN), Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit www.nordsonyestech.com