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Literature

White Papers & Technical Documents

Life Science and Medical Device Applications

Plasma Processing for Optimal Medical Device Manufacturing

Surface Adhesion

Surface Preparation for Improved Adhesion

Printed Circuit Board Applications

Plasma Process for Printed Circuit Board Manufaturing

Plasma Applications in the Printed Circuit Industry

Optimization of Ion and Electron Properties in Integrated Circuit Packaging Applications

Desmear

Vacuum Plasma Desmear Uniformity Measurement for Rigid and Flex Printed Circuit Boards

Teflon Activation

Activating Through Holes in Teflon Material

Semiconductor and Wafer Applications

Electrode Temperature in Plasma Process

Microelectronics Production

How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and Optoelectronics

Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology

Optical Fiber Cladding Removal

Wire Bonding

Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding Performance

Critical Plasma Processing Parameters for Improved Strength of Wire Bonds

Working Around the Flourine Factor in Wire Bond Reliability

Assembly Using X-Wire™ Insulated Bonding Wire Technology

Bonding Strengths at Plastic Encapsulant -- Gold Plated Copper Leadframe Interface

Technology Drivers for Plasma Prior to Wire Bonding

Underfill

Plasma for Underfill Process in Flipchip Packaging

Surface Modification Processes

Cleaning and Contamination Removal

Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System

Plasma Cleaning of Copper Leadframe with Ar and Ar/H₂ Gases

Etching

Controlled Chemical Plasma Etching for Advanced Technology Applications

Mold De-cap

Using Plasma Processing as a Mold De-Cap Method for Copper Wire Bonded Devices