Plasma Applications for Semiconductor and Wafer

• Critical Plasma Processing Parameters for Improved Strength of Wire Bonds


• Plasma for Underfill Process in Flipchip Packaging


• Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination


• Technology Drivers for Plasma Prior to Wire Bonding


• Plasma-Enhanced Surface Modification Improves Production of Microelectronics


• Fluorine Factor in Wire Bond Reliability


• Bonding Strengths at Plastic Encapsulant-Gold-Plated Copper Leadframe Interface


• Preventing Adhesive Resin Bleed in Microelectronics Assembly


• Electrode Temperature in Plasma Process


• Plasma Cleaning of Copper Leadframe with Ar and Ar/H₂ Gases


• Surface Preparation for Improved Adhesion


• Controlled Chemical Plasma Etching

Semiconductor Applications Team

Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A.

Dr. Zhao joined Nordson MARCH in 2001. He is responsible for application process development, R&D and key account support. Prior to Nordson MARCH, Dr. Zhao has held positions in the university system and semiconductor industry. Dr. Zhao holds a Ph.D. in Chemical Engineering from the University of Missouri-Columbia and has been working in the plasma application field for more than 10 years.