Plasma Solutions for Semiconductor Manufacturing

Nordson MARCH has a variety of plasma treatment solutions specifically designed for the unique needs of the advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP) and micro electro mechanical (MEMS) industries. Plasma applications include cleaning, wire bond improvement, descum, bump adhesion, stripping and etch.

Featured Semiconductor

Via Cleaning for WLP

WLP - Optimized plasma configurations from Nordson MARCH can effectively treat small vias without damaging the wafer surface.

Bump Adhesion

WLP - Plasma cleaning of the wafer surface using Nordson MARCH systems improves bump adhesion and has been demonstrated to increase bump shear strength dramatically.

Dielectric Patterning

WLP - In forming the redistribution layer, plasma processing with Nordson MARCH systems is a viable alternative for dielectric patterning where typical wet processing methods can be avoided.

BCB & UBM Adhesion

WLP - Plasma systems from Nordson MARCH can alter the topography and wettability of the wafer's original passivation layer to promote adhesion of polymers such as benzocyclobutene (BCB).

Wafer Pre-Treatment

WLP - Plasma removes contamination & oxidation, increasing reliability & bonding yields. It also improves adhesion between the wafer passivation layer & BCB.

Stripping & Etch for WLP

WLP - Plasma processing using Nordson MARCH systems is an efficient method for bulk stripping & etching of materials in wafer level packaging, MEMS manufacture, & disk drive processing

Descum for WLP

WLP - Plasma treatment technology from Nordson MARCH provides uniform removal of small quantities of resist over the entire surface of the wafer prior to further post processing.

Wafer Cleaning

WLP - Plasma removes fluorine, oxides, & metal contamination, significantly enhancing the yield, reliability, & performance of the integrated circuit.

Encapsulation & Molding for ASPA

ASPA - Nordson MARCH's plasma processing technology greatly improves adhesion of mold compounds by increasing the substrate surface energy, resulting in increased package reliability.

Underfill for ASPA

ASPA - Using plasma treatment technology from Nordson MARCH prior to the underfill process increases underfill wicking speed, adhesion, fillet height & uniformity, and minimizes voiding

Wire Bond for ASPA

ASPA - Nordson MARCH's plasma processing technology optimizes the wire bonding process, which increases device reliability and minimizes manufacturing costs

Die Attach for ASPA

ASPA - Plasma systems from Nordson MARCH can clean substrates in order to improve the adhesion of die attach epoxy via surface activation. Plasma also removes oxidation from the metal surface.