Wafer Pre-Treatment

Plasma processing removes contamination and oxidation for increased reliability and bonding yields. Plasma also micro-roughens the wafer passivation layer for improved adhesion between the wafer passivation layer and BCB.

Contaminants - such as oxides, organics, and fluorides - are a growing concern as geometries decrease and the ratio between the contaminant and feature increases. The larger ratio results in reduced yield and reliability of the packaged product.

Related Products

FlexTRAK Plasma Treatment System

The FlexTRAK from Nordson MARCH offers high-throughput capability. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.

FlexTRAK-WF Plasma Treatment System

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

FlexTRAK-WR Plasma System

The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter.

White Papers

Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System

Plasma Cleaning of Copper Leadframe with Ar and Ar/H₂ Gases

Surface Preparation for Improved Adhesion

Controlled Chemical Plasma Etching for Advanced Technology Applications