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The TrophoSPHERE™ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The StratoSPHERE™ plasma system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability.
The Nordson MARCH FlexTRAK™ series of gas plasma equipment provides unparalleled treatment uniformity and process consistency.
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System
Plasma Cleaning of Copper Leadframe with Ar and Ar/H2 Gases
Surface Preparation for Improved Adhesion
Controlled Chemical Plasma Etching for Advanced Technology Applications
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