Semiconductor & Wafer image

Wafer Cleaning

Plasma cleaning has traditionally been applied to remove contamination generated during a process in the device fabrication at the wafer level, or generated during an upstream assembly process. In either case, cleaning the product to remove contamination such a fluorine, oxides or metals significantly enhances the yield, reliability and performance of the integrated circuit.

 

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The TrophoSPHEREâ„¢ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

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