Via Cleaning for WLP

Small vias, formed in the wafer for stacked die applications, often have residue remaining as a result of the via-formation process. Optimized plasma configurations can effectively treat the vias without damaging the wafer surface.

Related Products

FlexTRAK Plasma Treatment System

The FlexTRAK from Nordson MARCH offers high-throughput capability. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.

FlexTRAK-WF Plasma Treatment System

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

FlexTRAK-WR Plasma System

The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter.

White Papers

How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and Optoelectronics

Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System

Activating Through Holes in Teflon Material