Go
Search Go
Semiconductor & Wafer image

Dielectric Patterning

Typical methods of forming the redistribution layer include patterning the dielectric redistribution material using typical photolithography methods. Plasma treatment is a viable alternative for dielectric patterning where typical wet processing methods can be avoided.

 

Related Products

FlexTRAK Plasma Treatment SystemFlexTRAK Plasma Treatment System

The FlexTRAK is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors.

FlexTRAK-WF Plasma Treatment SystemFlexTRAK-WF Plasma Treatment System

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

FlexTRAK-WR Plasma SystemFlexTRAK-WR Plasma System

The FlexTRAK-WR Plasma System is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter