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The FlexTRAK from Nordson MARCH offers high-throughput capability. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.
The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter.
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System
Controlled Chemical Plasma Etching for Advanced Technology Applications
Plasma Cleaning of Copper Leadframe with Ar and Ar/H2 Gases
Surface Preparation for Improved Adhesion