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Plasma cleaning of the wafer surface improves bump adhesion and has been demonstrated to increase bump shear strength dramatically. Bump materials include solder of varying compositions and gold studs.
The TrophoSPHERE™ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The StratoSPHERE™ plasma system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability.
The Nordson MARCH FlexTRAK™ series of gas plasma equipment provides unparalleled treatment uniformity and process consistency.
Surface Preparation for Improved Adhesion
How Plasma-Enhanced Surface Modification Improves the Production of Microelectronics and Optoelectronics
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System
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