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BCB & UBM Adhesion

Plasma treatment alters the topography and wettability of the wafer’s original passivation layer to promote adhesion.

Polymers, such as benzocyclobutene (BCB) and UBM, are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma treatment alters the topography and wettability of the wafer’s original passivation layer to promote adhesion.

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