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Polymers, such as benzocyclobutene (BCB) and UBM, are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma treatment alters the topography and wettability of the wafer’s original passivation layer to promote adhesion.
The TrophoSPHERE™ Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.
The StratoSPHERE™ plasma system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability.
The FlexTRAK is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors.
Surface Preparation for Improved Adhesion
Argon Plasma Cleaning of Fluorine, Organic and Oxide Contamination Using an Advanced Plasma Treatment System
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