Go
Search Go
Semiconductor & Wafer image

BCB & UBM Adhesion

Polymers, such as benzocyclobutene (BCB) and UBM, are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma alters the topography and wettability of the wafer’s original passivation layer to promote adhesion.

 

Related Products

FlexTRAK Plasma Treatment SystemFlexTRAK Plasma Treatment System

The FlexTRAK is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors.

FlexTRAK-WF Plasma Treatment SystemFlexTRAK-WF Plasma Treatment System

The FlexTRAK-WF Plasma System is designed for high-throughput processing of semiconductor wafers (and other flat substrates) in sizes ranging from 3 in. to 200mm (8 in.) in diameter, for wafers held in open cassettes.

FlexTRAK-WR Plasma SystemFlexTRAK-WR Plasma System

The FlexTRAK-WR Plasma System is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter