As semiconductor device manufacturers attempt to further shrink the size and increase the reliability of packaged devices, plasma is increasingly used for advanced applications during wafer level packaging.
Typical applications include incoming wafer cleaning; organic and inorganic contamination removal; etching of thin film layers including silicon nitride, silicon oxide, and benzocylcobutene (BCB); removal of wafer-applied mold or encapsulation material; photoresist etching and descum; wafer surface cleaning and roughening; and surface activation to improve bondability, increase wettability, and improve uniformity of liquid flow over the wafer surface.
Nordson MARCH’s plasma systems for WLP applications are designed to provide highly repeatable results with excellent etch rates and uniformity (both within wafer and wafer-to-wafer). Our systems are also capable of handling multiple wafer sizes (including 6, 8 and 12 inch wafers) and are capable of high-throughput automated processing.
Options include SECS/GEM factory automation software. Our WLP plasma systems are also configurable to meet your demanding production requirements.
Solutions for WLP, MEMS, TFH, Image Sensors, & PV
Wafer Cleaning |
Descum | Stripping and Etch | Wafer Pre-Treatment |
BCM & UBM Adhesion |
Dielectric Patterning | Via Cleaning | Bump Adhesion